Feed: AnandTech
Feed Link: https://www.anandtech.com
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Title: Rapidus Wants to Offer Fully Automated Packaging for 2nm Fab to Cut
Chip Lead Times

Date: Tue, 13 Aug 2024 08:00:00 EDT
Link: https://www.anandtech.com/show/21525/rapidus-...

One of the core challenges that Rapidus will face when it kicks off volume
production of chips on its 2nm-class process technology in 2027 is lining up
customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-
class nodes by that time, Rapidus will need some kind of advantage to attract
customers away from its more established rivals. To that end, the company
thinks they've found their edge: fully automated packaging that will allow
for shorter chip lead times than manned packaging operations.

In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined
the company's vision to use advanced packaging as a competitive edge for the
new fab. The Hokkaido facility, which is currently under construction and is
expecting to begin equipment installation this December, is already slated to
both produce chips and offer advanced packaging services within the same
facility, an industry first. But ultimately, Rapidus biggest plan to
differentiate itself is by automating the back-end fab processes (chip
packaging) to provide significantly faster turnaround times.

Rapidus is targetting back-end production in particular as, compared to front-
end (lithography) production, back-end production still heavily relies on
human labor. No other advanced packaging fab has fully automated the process
thus far, which provides for a degree of flexibility, but slows throughput.
But with automation in place to handle this aspect of chip production,
Rapidus would be able to increase chip packaging efficiency and speed, which
is crucial as chip assembly tasks become more complex. Rapidus is also
collaborating with multiple Japanese suppliers to source materials for back-
end production.

"In the past, Japanese chipmakers tried to keep their technology development
exclusively in-house, which pushed up development costs and made them less
competitive," Koike told Nikkei. "[Rapidus plans to] open up technology that
should be standardized, bringing down costs, while handling important
technology in-house."

Financially, Rapidus faces a significant challenge, needing a total of �5
trillion ($35 billion) by the time mass production starts in 2027. The
company estimates that �2 trillion will be required by 2025 for prototype
production. While the Japanese government has provided �920 billion in aid,
Rapidus still needs to secure substantial funding from private investors.

Due to its lack of track record and experience of chip production as. well as
limited visibility for success, Rapidus is finding it difficult to attract
private financing. The company is in discussions with the government to make
it easier to raise capital, including potential loan guarantees, and is
hopeful that new legislation will assist in this effort.

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